The company has a large number of PCB production, management personnel and strictly trained QA quality personnel to ensure the production of high-quality printed circuit board products, while meeting ROHS and REACH requirements. All along, the company has been absorbing excellent PCB professional and technical personnel and management personnel, constantly introducing advanced management concepts, striving to improve management level, in order to meet the greatest needs of customers for the purpose of stable quality, fast delivery speed to provide customers with first-class services.

NO	Iitems	Capabilities
1	Layer Counts	2-16
2	Max pannel size	22"x32"(558mmx812mm)
3	Min line space/width	3mil/3mil(0075mm/0075mm)
4	Mininner layer PAD	4mil(0.1mm)
5	Mininner layer thick	4mil(0.1mm)
6	Irner layer Cu thick	0.5-2.0 oz
7	Hole wall thusck	18-30um
8	HAL (lead    free)tinthick	150-1000u"(3.75-25um)
9	Outlayer Cuthick	0.5-2.0 oz
10	Board thick range	0.4-5.0mm
11	Board thick tolerance	±10%
12	Stackup alignment	±2mi1(±50um)
13	Min drill hole	0.15mm
14	Hole to hole position	±2mil(±50um)
15	Hole tolerance	±1mil(±25um)
16	Throughhole aspect    ratio	10:01
17	PAD alignment    accuracy	3mil/3mil(0.075mm/0.075mm)
18	Etching tolerance	±10%
19	Min soldermask bridge	3mil(0.075mm)
20	Max.plug via hole	0.5mm
21	Surface treatment    Capabilities	HAL、ENIG、OSP、Carbonink、Gold finger、immersiontin、lmmersionsilver
22	Max hard gold thick	≤100u"(≤2.5um)
23	ENIG thick	1-3 UM"
24	Impedance tolerance	±10%
25	Max.twist & warp	≤0.75%